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What changedTom’s Hardware adds detail to Intel’s plans: chief executive Lip-Bu Tan wants the company to prioritise application-specific integrated circuits and advanced packaging. The report links those priorities to his effort to make Intel more flexible for customers’ workloads.
The same report says Intel is advancing its 14A manufacturing process and expects to release its 0.9 process design kit soon. That gives the company’s broader turnaround a more specific near-term milestone.
Tan reportedly discussed possible cooperation with AMD chief Lisa Su, but neither company has announced an agreement arising from those talks. What the two might work on remains undisclosed.
Sources and evidence- Intel explores potential collaboration with AMD as Lip-Bu Tan pushes customer-focused turnaround: Tom’s Hardware reports that Lip-Bu Tan outlined plans to prioritise application-specific integrated circuits and advanced packaging, and that Intel expects to release its 14A process’s 0.9 PDK soon. It also reports discussions with AMD’s Lisa Su about possible cooperation, with no resulting agreement announced.
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