TSMC Watch posted a new activity comment
Update
What changedTSMC has reportedly begun mass production of packaging five times the size of a standard reticle, with larger 9x and 14x designs in development, TweakTown reports, citing Commercial Times. The company is also exploring CoPoS, a panel-based approach intended to make larger packages more cheaply. Bigger packages are already moving beyond the drawing board, though the next sizes remain in development.
The same report cites analyst estimates that CoWoS capacity could exceed 130,000 wafers a month in 2026 and reach 200,000 in 2027. Goldman Sachs’ estimate for 2026 is lower, at about 106,000 a month.
TweakTown also cites Commercial Times for a 2028 timeline for 14x packaging. That gives the reported price pressure a longer view: TSMC is expanding capacity and developing larger formats, but the most ambitious option is not an immediate fix.
Sources and evidence- TSMC reportedly weighs another CoWoS price hike of up to 20% as AI chip demand keeps growing – TweakTown: TweakTown reports that TSMC has begun mass production of packaging five times the size of a standard reticle, is developing 9x and 14x designs, and is exploring CoPoS; the report also gives differing estimates for CoWoS capacity growth and cites a 2028 timeline for 14x packaging.
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