One signal

Update

What changed

Update: TSMC’s reported expansion plan is broader than the earlier capacity headline. Economic Daily News says monthly 2nm capacity could rise from 90,000 wafers at end-2026 to 110,000 by mid-2027, while 3nm could grow from more than 180,000 to 210,000. The supplied account also says TSMC is adding three 3nm fabs across Taiwan, Arizona and Japan, and that CoWoS packaging capacity could double to roughly 260,000 wafers a month by the end of 2028. TSMC’s July guidance put 2026 capital spending at $60bn to $64bn, with 70% to 80% for advanced processes. These are reported plans, not confirmed guidance, and the packaging expansion leaves room for Intel’s EMIB-T to compete for custom AI accelerators.

Sources and evidence

• Economic Daily News, as reported in the supplied TrendForce evidence: TSMC’s reported target is to increase monthly 2nm capacity from 90,000 wafers at end-2026 to 110,000 by mid-2027, and 3nm capacity from more than 180,000 to 210,000.

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