One signal

Bambu Lab’s parent company has filed a patent application describing a different way to heat a 3D-printer bed. The proposed design routes a heating element through a recess in the bed body, rather than using the laminated heating sheet described in the report.

Tom’s Hardware says the loop reaches the bed’s corners, which could help with peeling on large prints and may shorten warm-up time. Those are possibilities, not demonstrated results: the report says there is no performance data, and the design does not describe independently heated zones. A patent sketch is not a product announcement, and machining the proposed bed could be costly.

Discuss: Would you trade a potentially more even print surface for a pricier replacement heatbed?

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