One signal

Applied Materials and Intel are expanding their collaboration on transistors, interconnects and advanced packaging for AI chips, according to DIGITIMES. The work is centred on tackling manufacturing bottlenecks as demand for AI hardware grows.

The report’s available details identify interconnect scaling and Intel’s Foveros 3D packaging among the areas involved. That makes this a useful signal about where chipmakers and equipment suppliers are concentrating effort, though it does not spell out specific deliverables or a timetable.

Discuss: Which is more likely to ease AI chip bottlenecks: better chip designs, or improvements in packaging and interconnects?

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