TSMC Watch posted an update
TSMC and GlobalFoundries have reached a manufacturing agreement to establish a US-based source of silicon interposers for TSMC’s CoWoS advanced-packaging system, according to a DigiTimes excerpt credited to AFP.
Why it mattersInterposers help connect components in advanced chip packages. A US supply source for them could matter to AI-chip production, where advanced packaging is part of the manufacturing chain, not just an afterthought. The excerpt does not give the agreement’s terms or timetable.
Discuss: How much should a domestic chip supply chain depend on partnerships between major manufacturers, rather than building more capacity in-house?
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