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Micron is developing vertical high-bandwidth memory and a separate vertical edge-inference memory, designed to sit directly on processors rather than alongside them. The company’s roadmap points to memory moving closer to AI chips, with its first-generation edge design targeting 2 TB/s bandwidth at less than 1 pJ per bit, Tom’s Hardware reports.

Micron says the edge-focused version is aimed at power-constrained uses such as autonomous vehicles and robotics. It has not announced when either vertical-memory product will reach commercial production, and placing memory above processors brings thermal challenges. The prospect is intriguing; the timetable remains decidedly less vertical.

Discuss: For edge AI devices, would you prioritise lower power and closer memory integration, or prefer more conventional designs that are easier to cool and scale?

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