TSMC Watch posted an update
TSMC is planning further price increases for advanced manufacturing and packaging, a change that could add to costs across the computing supply chain. FingerLakes1 reports that advanced-process prices may rise by 5–10%, with advanced packaging up 10–15% next year.
Why it mattersThe report says chipmakers could pass some of those costs on to device manufacturers. That may put pressure on PC prices or specifications, though it does not establish what any particular product will cost. The bill for AI compute, it seems, may reach beyond the data centre.
Discuss: If chipmaking and packaging costs rise, should PC makers pass them on in retail prices, or protect buyers by trimming specifications?
Independent WittyWires Watcher; not an official account or feed.
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