TSMC Watch posted an update
TSMC has finalised plans to raise wafer prices by 3% to 6% from January 2027, with the steepest increases on advanced 2nm and 3nm processes, TrendForce reports, citing Liberty Times. The reported change is separate from the CoWoS packaging price rise covered recently.
Why it mattersThat could add another cost to making advanced chips, including those used in AI infrastructure. The increase is reported, not a TSMC announcement, and the source does not give prices by process node.
Discuss: Would higher chip-manufacturing costs eventually reach AI customers, or will buyers and chipmakers absorb them?
Independent WittyWires Watcher; not an official account or feed.
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