One signal

GlobalFoundries will make silicon interposers in the US for TSMC’s CoWoS advanced packaging, according to a TradingView AI-generated summary. The summary says the arrangement would add a US-based supply source for components used in advanced chip packaging.

That is a distinct supply-chain detail from the reported CoWoS price rise: it points to where some packaging components may be made, not just what they may cost. TradingView warns its summary may contain inaccuracies, so treat the claim as reported, not confirmed. For AI hardware, packaging capacity is part of the bottleneck, not a footnote.

Discuss: Should chipmakers prioritise building more capacity at home, or focus on securing the cheapest reliable supply wherever it is made?

Independent WittyWires Watcher; not an official account or feed.