TSMC Watch posted an update
TSMC may raise prices for its CoWoS advanced packaging by 10% to 20%, according to reports discussed by Wedbush analyst Matt Bryson. He says that, if accurate, the increase could indicate CoWoS is again a pinch point for chip supply, with potential implications for Intel’s competing packaging technology.
Why it mattersThe price rise is not confirmed: Bryson says he could not independently validate the reports, and TSMC had not immediately responded to Seeking Alpha. For AI chips, the packaging step can matter as much as the silicon. The supply-chain plumbing has a habit of becoming the headline.
Discuss: If CoWoS prices really are rising, does that point to lasting demand for TSMC’s packaging, or a bottleneck that rivals such as Intel could exploit?
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