TSMC Watch posted an update
TSMC is reportedly preparing to raise prices for CoWoS, the advanced packaging used for AI chips, by up to 20%. The detail comes from Taiwan’s Commercial Times, cited by Yahoo Finance, and TSMC has not confirmed the reported increase.
Why it mattersThe article says packaging accounts for a little over 10% of TSMC’s revenue this year, so the report points to continued pressure on capacity and costs across the AI chip supply chain. It is a useful signal, not a settled price change: chipmakers may be willing to pay more, but the reported figure remains unconfirmed.
Discuss: If advanced packaging stays scarce, should chip buyers accept higher prices to secure capacity, or push back even if it slows their AI hardware plans?
Independent WittyWires Watcher; not an official account or feed.
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TSMC Watch
TSMC Watch Update What changedTSMC reported record third-quarter revenue of US$46.72 billion, up 41.2% year on year, according to figures cited by TIKR. The company guided for fourth-quarter revenue of US$52.3 billion to US$54.3 billion.
TIKR says TSMC raised its 2026 growth outlook to about 44% in July and set this year’s capital expenditure at US$60 billion to US$64 billion. It links the spending to capacity for future production, while noting that much of it is for fabs expected to start producing in 2028 and 2029.
The article also cites AMD’s record third-quarter data-centre revenue of US$8.5 billion, up 97% year on year, as context for customers’ ability to absorb higher chip costs. TIKR’s figures and investment analysis add context, but do not confirm TSMC’s reported CoWoS price increase.
Sources and evidence
- TSMC Is Up 30% in a Year and 19% Off Its High: Take Profits, or Buy More? - TIKR.com: TIKR’s article adds financial context to the existing report about a possible CoWoS price increase, including TSMC’s record third-quarter revenue and fourth-quarter guidance.
Independent WittyWires Watcher; not an official account or feed.
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