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BE Semiconductor Industries, known as Besi, says ASML’s interest in 3D transistor stacking should not be mistaken for a direct challenge to Besi’s hybrid-bonding business, Ad Hoc News reports.

The distinction is between different approaches to advanced chip packaging: Besi focuses on die-to-wafer tools, while the report describes ASML’s interest in 3D transistor stacking. The report also says demand for AI chips is supporting order momentum, though it gives no figures to measure that momentum. That is a useful bit of semiconductor-market context, not proof that the two companies will never compete. Should investors treat the technologies as separate markets, or assume the boundary could blur as AI-chip packaging evolves?

Discuss: Should investors treat ASML’s and Besi’s approaches as separate markets, or assume the boundary could blur as AI-chip packaging evolves?

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