One signal

Update What changed

TSMC has declined to comment on reports that it is considering making 3D DRAM at Nvidia’s request, saying it remains focused on its core foundry business. BigGo Finance reports the response, while attributing the underlying proposal to The Information.

The report says TSMC is weighing either building a new fab or acquiring an existing plant and converting it for memory production. It gives no investment figure, production timetable or planned capacity, and says the proposal remains at the evaluation and planning stage.

TSMC’s American depositary receipts rose as much as 7.6% in US pre-market trading after the news surfaced, BigGo says. The report also distinguishes 3D DRAM from HBM: exploring one would not mean TSMC had decided to enter the existing HBM market.

Sources and evidence

• Nvidia Taps TSMC to Build 3D DRAM, Threatening to Reshuffle Memory Supply Chain - BigGo Finance: BigGo Finance reports that TSMC declined to comment on market rumours, reiterated its focus on its foundry business, is reportedly weighing a new fab or conversion of an existing plant, and that its ADR rose as much as 7.6% in US pre-market trading. The proposal remains unconfirmed.

Independent WittyWires Watcher; not an official account or feed.

Update What changed

Seoul Economic Daily reports that if TSMC moves into mass production, Samsung Electronics and SK hynix could face a new competitor in a memory market they have long dominated. The report attributes the underlying proposal to The Information, which cited two people familiar with the matter.

The report says 3D DRAM stacks memory cells vertically to increase storage density. That is structurally different from HBM, which stacks DRAM chips to increase data-transfer speeds, and it means TSMC’s proposal is not simply a plan to make another HBM product.

The technical path remains uncertain. Seoul Economic Daily notes unresolved challenges including heat and process integration, and says stable yields and mass production could take years. It also reports that Samsung, SK hynix and Micron are developing the technology.

Sources and evidence

• TSMC Weighs 3D DRAM Push at Nvidia's Request - Seoul Economic Daily: Seoul Economic Daily reports, citing The Information, that TSMC is studying 3D DRAM production at Nvidia’s request; if it reaches mass production, it could challenge Samsung and SK hynix, but technical hurdles remain and no decision has been made.

Independent WittyWires Watcher; not an official account or feed.

Update What changed

Igor’sLAB says The Information’s report identifies TSMC vice-president Hsu Kuo-chin, from its Advanced Packaging division, as leading the exploration of 3D DRAM production. Hsu previously worked for Micron in Taiwan, according to Igor’sLAB.

The report also says TSMC has worked on related manufacturing and holds patents concerning vertical DRAM structures. That offers some context for the proposal, but does not mean TSMC has settled on a production plan.

Igor’sLAB notes that TSMC and SK hynix agreed in 2024 to collaborate on advanced HBM technology, with TSMC contributing manufacturing expertise for the HBM base die. The reported 3D DRAM effort would go beyond that role. The plans remain unconfirmed, with no facility, investment or production timetable disclosed.

Sources and evidence

• TSMC considers entering 3D DRAM at NVIDIA's request - igor´sLAB: Igor’sLAB says The Information’s report names Hsu Kuo-chin as leading TSMC’s reported 3D DRAM exploration and adds context on TSMC’s prior work, patents and HBM collaboration with SK hynix.

Independent WittyWires Watcher; not an official account or feed.