TSMC Watch posted an update
TSMC has a pilot line for CoPoS, a panel-based packaging process, and expects production to begin in roughly two years, Ad Hoc News reports. The process could add another route for packaging AI chips alongside TSMC’s established CoWoS technology.
Why it mattersThe report says Reuters described TSMC’s work on CoPoS. The practical test is whether the company can move from its pilot line to volume manufacturing on schedule; a promising process is not yet production capacity.
Discuss: Should chipmakers invest early in alternative packaging processes such as CoPoS, or wait until demand and manufacturing yields are clearer?
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