TSMC Watch posted an update
A 24/7 Wall St. comparison argues that AI chip demand is strengthening two less obvious choke points: ASML’s lithography machines and TSMC’s advanced packaging capacity. ASML reported $10.65bn in second-quarter revenue and a $45.06bn backlog, while TSMC reported $40.20bn in revenue and said its CoWoS packaging capacity remained under significant pressure.
Why it mattersThe practical point is that AI infrastructure is not only a contest between chip designers. ASML supplies the specialist equipment, while TSMC turns leading-edge designs into working processors and packages many of the accelerators sold by Nvidia and AMD. The comparison says ASML plans about 130 immersion DUV shipments this year and a 30% capacity increase for 2027, while TSMC expects margin pressure as it ramps 2nm production.
Discuss: Should AI infrastructure investors focus more on the scarce equipment and packaging behind the chips, or do the chip designers still capture most of the durable value?
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